Modular scalable liquid cooled power system

Patent No. 9,516,794

Issued: December 6, 2016
Filed: October 30, 2015

Inventors: Mulcahy; Gary (Flanders, NJ), Icoz; Tunc (Bridgewater, NJ)
Assignee: Transistor Devices, Inc. (Hackettstown, NJ)

A scalable liquid cooled power system using a number of modularized, hot-plug, hot-swap, and scalable liquid-cooled power conversion modules mounted on mating mounting assemblies. A modularized, scalable liquid coolant manifolds and liquid cooling management system provides coolant circulation through the power conversion modules. The system optionally includes a highly scalable system control and administration system, and optionally provides the facility for on-board liquid-to-air heat exchanger system, or off-board cooling using an external heat exchanger system.

Reference to Related Applications

This application claims one or more inventions which were disclosed in Provisional Application No. 62/073,204, filed Oct. 31, 2014, entitled "Modular Scalable Liquid Cooled Power System". The benefit under 35 USC .sctn.119(e) of the United States provisional application is hereby claimed, and the aforementioned application is hereby incorporated herein by reference.

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